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Who we are ||
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日本語
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Deutsch ||
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Français
The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.
If youre looking for technical excellence, professional development and international networking opportunities, the CPMT Society can help you through its
journals,
conferences
and workshops, committee activities,
local chapter events,
educational programs and
awards.

  
IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010)
July 11-13, 2010
San Francisco CA, USA
Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)
August 16-19, 2010
Xi'an, China
Electronics System-Integration Technology Conference (ESTC 2010)
September 13-16, 2010
Berlin, Germany
IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (ASTR 2010)
October 6-8, 2010
Denver, CO, USA
ADDITIONAL CONFERENCES AND WORKSHOPS

   
CPMT Transactions
Profiles of our three IEEE Transactions; how to submit papers or contact the Editors
CPMT Society Newsletter
Read the latest Society news from around the globe.
More Publications Information
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