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Who we are ||
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The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.
If youre looking for technical excellence, professional development and international networking opportunities, the CPMT Society can help you through its
journals,
conferences
and workshops, committee activities,
local chapter events,
educational programs and
awards.

  
Int'l Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE 2010)
April 25-28, 2010
Bordeaux, France
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2010)
May 5-7, 2010
Seville, Spain
Workshop On Signal Propagation on Interconnects (SPI 2010)
May 9-12, 2010
Hildesheim, Germany
60th Electronic Components and Technology Conference (ECTC 2010)
June 1-4, 2010
Las Vegas, NV, USA
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010)
June 2-5, 2010
Las Vegas, NV, USA
ADDITIONAL CONFERENCES AND WORKSHOPS

   
CPMT Transactions
Profiles of our three IEEE Transactions; how to submit papers or contact the Editors
CPMT Society Newsletter
Read the latest Society news from around the globe.
More Publications Information
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