|
|
|
Who we are ||
中文
||
日本語
||
Deutsch ||
Italiano ||
Français
The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.
If youre looking for technical excellence, professional development and international networking opportunities, the CPMT Society can help you through its
journals,
conferences
and workshops, committee activities,
local chapter events,
educational programs and
awards.

  
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
July 28~31, 2008 Shanghai, China
7th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008)
August 17—22, 2008
Garmisch-Partenkirken, Germany
Electronics System-Integration Technology Conference (ESTC 2008)
September 1-4, 2008; University of Greenwich
Greenwich, London UK
2008 Workshop on Accelerated Stress Testing & Reliability (ASTR)
October 1 - 3, 2008 Portland, OR USA
ADDITIONAL CONFERENCES AND WORKSHOPS

   
CPMT Transactions
Profiles of our three IEEE Transactions; how to submit papers or contact the Editors
CPMT Society Newsletter
Read the latest Society news from around the globe.
More Publications Information
|
Click image, for more information:
|