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Foreword

A. Deutsch and M. Swaminathan

[p. 338]

Modeling and Transient Simulation of Planes in Electronic Packages

N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan

[p. 340]

Lossy Power Distribution Networks with Thin Dielectric Layers and/or Thin Conductive Layers

I. Novak

[p. 353]

Design and Performance Evaluation of Microprocessor Packaging Capacitors Using Integrated Capacitor-Via-Plane Model

Y.-L. Li, T.-G. Yew, C. Y. Chung, and D. G. Figueroa

[p. 361]

Modeling the Effects of Nonlinear Materials in Ceramic Chip Capacitors for Use in Digital and Analog Applications

G. J. Cokkinides and B. Becker

[p. 368]

Broadband Modeling and Measurement of the Signal Behavior in S/390 MCM Packages

F. M. Ktata, U. Arz, and H. Grabinski

[p. 375]

Efficient Passive Circuit Models for Distributed Networks with Frequency-Dependent Parameters

A. Dounavis, R. Achar, and M. S. Nakhla

[p. 382]

Limitations on the Extraction of Loss Tangent from Submicron Transmission Line Test

R. J. Friar and D. P. Neikirk

[p. 393]

RF Interconnect for Multi-Gbit/s Board-Level Clock Distribution

W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim

[p. 398]

CONTRIBUTED PAPERS

Area Array Connections

Rate Dependent Constitutive Relations Based on Anand Model for 92.5Pb5Sn2.5Ag Solder

J. Wilde, K. Becker, M. Thoben, W. Blum, T. Jupitz, G. Wang, and Z. N. Cheng

[p. 408]

Impact of Solder Pad Size on Solder Joint Reliability in Flip Chip PBGA Packages

L. L. Mercado, V. Sarihan, Y. Guo, and A. Mawer

[p. 415]

Impact Properties of PBGA Assemblies Reflowed in Nitrogen Ambient and Compressed Air

Y. P. Wu and Y. C. Chan

[p. 421]

Package Structures

Analytical Approach to Temperature Evaluation in Bonding Wires and Calculation of Allowable Current

G. T. Nöbauer and H. Moser

[p. 426]

Process Induced Warpage in Multitiled Alumina Substrates for Large Area MCM-D Processing

A. X. H. Dang, I. C. Ume, and S. K. Bhattacharya

[p. 436]

High-Density Printed Circuit Board Using B²it^TM Technology

K. Goto, T. Oguma, and Y. Fukuoka

[p. 447]

Influence of the Grain Boundary Phase on the Mechanical Strength at Aluminum Nitride Substrate Surfaces

H. Asai and T. Takahashi

[p. 452]

CONTRIBUTED PAPERS

Optoelectronic Packaging

Passive Alignment Optical Subassemblies for Military/Aerospace Fiber-Optic Transmitter/Receiver Modules

M. W. Beranek, E. Y. Chan,C. C. Chen, K. W. Davido, H. E. Hager, C. S. Hong, D. G. Koshinz, M. Rassaian, H. P. Soares, Jr., R. L. St. Pierre, P. J. Anthony, M. A. Cappuzzo, J. V. Gates, L. T. Gomez, G. E. Henein, J. Shmulovich, M. A. Occhionero, and K. P. Fennessy

[p. 461]

Package Performance

S-Parameter-Measurement-Based High-Speed Signal Transient Characterization of VLSI Interconnects on SiO

₂

-Si Substrate

Y. Eo, W. R. Eisenstadt, and J. Shim

[p. 470]

A Fast 3-D Modeling Approach to Electrical Parameters Extraction of Bonding Wires for RF Circuits

X. Qi, C. P. Yue, T. Arnborg, H. T. Soh, H. Sakai, Z. Yu, and R. W. Dutton

[p. 480]

Capacitance Extraction for Electrostatic Multiconductor Problems by On-Surface MEI

Y. Liu, K. Lan, and K. K. Mei

[p. 489]

Embedded Microstrip Interconnection Lines for Gigahertz Digital Circuits

W. Ryu, S.-H. Baik, H. Kim, J. Kim, M. Sung, and J. Kim

[p. 495]

System Packaging

Hardware Technology for the HITACHI MP5800 Series (HDS Skyline Series)

F. Kobayashi, Y. Watanabe, K. Kasai, K. Koide, K. Nakanishi, and R. Sato

[p. 504]

MCM-D/C Packaging Solution for IBM Latest S/390 Servers

E. D. Perfecto, R. R. Shields, A. K. Malhotra, M. P. Jeanneret, D. C. McHerron, and G. A. Katopis

[p. 515]

Design of a High Speed Processor System Bus for Notebook Computers

P. Hsu, Y. Tian, and G. Pasdast

[p. 521]

A Compact Three-Dimensional Packaging Technique Using Super-Fine-Pitch Coaxial Connector Arrays for On-Board Satellite Equipment

F. Ishitsuka, N. Iwasaki, T. Ohira, Y. Suzuki, and Y. Ando

[p. 530]

Package Processing and Reliability

Adhesion and Adhesion Reliability Enhancement of Evaporated Copper on Surface Modified Poly(tetrafluoroethylene) Films from Graft Copolymerization

S. Wu, E. T. Kang, K. G. Neoh, C. Q. Cui, and T. B. Lim

[p. 538]

Development of Measurement System for Die-Pad Behavior in IC Encapsulation Process Using Hall Elements

M. Sato and H. Yokoi

[p. 546]

Linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in LSI Plastic Packages under Temperature Cyclic Loading--Part II: Material Properties and Package Geometry Factors

T. Saitoh, H. Matsuyama, and M. Toya

[p. 554]

An Investigation of the Electrical Contact Resistance of Corroded Pore Sites on Gold Plated Surfaces

R. Martens and M. G. Pecht

[p. 561]

Underfill Adhesion to BCB (Cyclotene^TM) Bumping and Redistribution Dielectrics

P. Garrou, D. Scheck, J. Im, J. Hetzner, G. Meyers, D. Hawn, J. Wu, M. Vincent, and C. P. Wong

[p. 568]

Influences of Molding Conditions on Die-pad Behavior in IC Encapsulation Process Analyzed by Hall Element Method

M. Sato and H. Yokoi

[p. 574]

Assessment of Backside Processes Through Die Strength Evaluation

B. H. Yeung, V. Hause, and T.-Y. T. Lee

[p. 582]

ANNOUNCEMENTS

Call for Papers--14th International Conference on Industrial and Engineering Applications of Artificial Intelligence and Expert Systems

[p. 588]