Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely
download the PDFs of any of these papers, at the XPLORE On-Line Library.
Guests may access abstract/citation records free of charge.
|
Foreword: Electrical Design Papers from the 2000 Electronic Components and Technology Conference
|
|
Rules
for robust generation of accurate reduced-order models for high-speed coupled
interconnections |
|
An
all-purpose dispersive multiconductor interconnect model compatible with
PRIMA |
|
Modeling
of simultaneous switching noise in high speed systems |
|
Modeling
DC power-bus structures with vertical discontinuities using a circuit
extraction approach based on a mixed-potential integral equation
|
|
An
overview of solder bump shape prediction algorithms with validations
|
|
Nondestructive
methodology for standoff height measurement of flip chip on flex (FCOF) by
SAM |
|
Multichip
module photovoltaic miniarrays |
|
Electron
beam enhanced multilayering and planarization in preimidized polyimides
|
|
Analysis
of the bounces on the power/ground plane structures by planar circuit model
and APA-E algorithm |
|
Time
domain modeling of lossy interconnects |
|
Effect
of intermetallic compounds on vibration fatigue of /spl mu/BGA solder joint
|
|
Chip-scale
packaging of power devices and its application in integrated power
electronics modules |
|
Failure
analysis and stress simulation in small multichip BGAs |
|
Correction
to "lossy power distribution networks with thin dielectric layers and/or
thin conductive layers" |
|
Associate
editors, guest editors, and reviewers |