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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A

September 1995, Volume 18, Issue 3

CONTRIBUTIONS FROM THE INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM

FOREWORD

W. J. Trybula

Chip Scale Package: "A Lightly Dressed LSI Chip"

M. Yasunaga, S. Baba, M. Matsuo, H. Matsushima, S. Nakao, and T. Tachikawa

Advanced Low-Cost Bare-DIE Packaging Technology for Liquid Crystal Displays

J. C. Hwang

Low-Cost Multichip Modules

M. Dobers, M. Seyffert, F. D. Hauschild, and C.-P. Czaya

Quick Inspection of Power-Plane Short Fault on Multilayer Substrate

F.-L. Chao and R.-B. Wu

Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable, High Performance, Low Cost Sealed Chip-on-Board (SCOB) Assemblies

R. M. Kubacki

In-Situ Prediction of Reactive Ion Etch Endpoint Using Neural Networks

M. D. Baker, C. D. Himmel, and G. S. May

Capacity Utilization Bottleneck Efficiency System---CUBES

J. M. Konopka

Sequential Experiments to Characterize Processing Equipment---Maximizing Information Content While Restraining Costs

J. E. Reece

CONTRIBUTIONS FROM THE FOURTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMO MECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS

FOREWORD

D. Agonafer, S. H. Bhavnani, and J. S. Fitch

Gas-Assisted Evaporative Cooling of High Density Electronic Modules

A. Bar-Cohen, G. Sherwood, M. Hodes, and G. Solbreken

Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Slot Nozzle Suction and Impingement

D. Copeland

Coarse and Detailed CFD Modeling of a Finned Heat Sink

R. L. Linton and D. Agonafer

Thermal Limitations in Optical Recording

D. J. Nelson and B. Vick

Jet Impingement Boiling of a Dielectric Coolant in Narrow Gaps

G. M. Chrysler, R. C. Chu, and R. E. Simons

Effect of Channel Width on Pool Boiling from a Microconfigured Heat Sink

R. M. Nowell, Jr., S. H. Bhavnani, and R. C. Jaeger

Finding Unknown Surface Temperatures and Heat Fluxes in Steady Heat Conduction

T. J. Martin and G. S. Dulikravich

Entrance Analysis of Turbulent Flow in an Array of Heated Rectangular Blocks

M. Faghri, M. Molki, J. Chrupcala, and Y. Asako

Thermap : A Thermal Model for Microprocessors

J. S. Fitch, L. Monier, and H. Tamet

Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection

J. R. Culham, M. M. Yovanovich, and S. Lee

Concurrent Design and Analysis of the Navigator Wearable Computer System: The Thermal Perspective

C. H. Amon, J. S. Nigen, D. P. Siewiorek, A. Smailagic, and J. Stivoric

A Shear-Based Optimization of Adhesive Thickness for Die Bonding

K. E. Hokanson and A. Bar-Cohen

Nonlinear Finite Element Simulation of Thermoviscoplastic Deformation of C4 Solder Joints in High Density Packaging Under Thermal Cycling

B. Z. Hong and L. G. Burrell

Cooling Performance of Plate Fins for Multichip Modules

H. Iwasaki, T. Sasaki, and M. Ishizuka

Enhancement of a Two-Phase Thermosyphon for Cooling High Heat Flux Power Devices

H. Kuwahara, K. Takahashi, T. Nakajima, T. Takahashi, and O. Suzuki

REGULAR PAPERS

Failure Modes and Failure Analysis

Electrochemical Processes Resulting in Migrated Short Failures in Microcircuits

G. Harsányi

Thermal Fatigue Behavior of J-Lead Solder Joints

C. G. Schmidt, J. W. Simons, C. H. Kanazawa, and D. C. Erlich

Bimaterial Interfacial Crack Growth as a Function of Mode-Mixity

S. Liu, Y. Mei, and T. Y. Wu

Investigation of Crack Propagation in Ceramic/Conductive Epoxy/Glass Systems

S. Liu, J. S. Zhu, J. M. Hu, and Y.-H. Pao

Behavior of Delaminated Plastic IC Packages Subjected to Encapsulation Cooling, Moisture Absorption, and Wave Soldering

S. Liu and Y. Mei

Materials, Processes, and Design

High Solder-Reflow Crack Resistant Molding Compound

A. A. Gallo and T. R. Tubbs

Comparison of Methods for Measuring Flow of Resin in Electrical Laminating Prepregs

R. A. Tait

A Dielectric Surface Coating Technique to Enhance Boiling Heat Transfer from High Power Microelectronics

J. P. O'Connor, S. M. You, and D. C. Price

A Structured Approach for Analysis of Design Processes

A. Kusiak, J. Wang, D. W. He, and C.-X. Feng

Computation of Resistance and Inductance Matrices in a Symmetric Structure

C.-C. Huang

Nondestructive Detection of Defects in Multilayer Ceramic Capacitors Using Digital Speckle Correlation Techniques

Y. C. Chan, F. Yeung, G. Jin, N. Bao, and P. S. Chung

Minimizing the Computational Cost and Memory Requirements for Capacitance Calculation of 3-D Multiconductor Systems

M. Ouda and A.-R. Sebak

Laser-Formed Metallic Connections Employing a Lateral Link Structure

J. B. Bernstein and B. D. Colella

Effects on Contact Resistance of Passing Electrical Current Through Wiping Palladium Contacts

Z.-K. Chen, K. Karasawa, K. Sawa

Electrical Contacts

Effects of Wipe on Contact Resistance of Aged Surfaces

R. D. Malucci

Application of Numerical Field Simulations for Low-Voltage Circuit Breakers

M. Lindmayer and H. Stammberger