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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

March 1996, Volume 19, Issue 1

EDITORIAL

A. Bar-Cohen

CONTRIBUTIONS FROM THE 45th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

SPECIAL SECTION ON ADVANCED INTERCONNECTS AND MATERIALS

FOREWORD

J. M. Segelken

A New Approach to Using Anisotropically Conductive Adhesives for Flip Chip Assembly

A. M. Lyons, E. Hall, Y.-H. Wong, and G. Adams

Gold Wire Bonding onto Flexible Polymeric Substrates

E. Hall, A. M. Lyons, and J. D. Weld

Characteristics and Potential Application of Polyimide-Core-Bump to Flip Chip

T. Nishimori, H. Yanagihara, K. Murayama, Y. Kama, and M. Nakamura

Reliability Investigations of Fluxless Flip-Chip Interconnections on Green Tape Ceramic Substrates

J. Kloeser, E. Zakel, F. Bechtold, and H. Reichl

Silicon Motherboards for Multichannel Optical Modules

A. Ambrosy, H. Richter, J. Hehmann, and D. Ferling

Autocatalytic Gold Plating Process for Electronic Packaging Applications

J. G. Gaudiello

SPECIAL SECTION ON THERMAL DESIGN AND ANALYSIS

FOREWORD

J. S. Fitch

Mounting of High Power Laser Diodes on Diamond Heatsinks

S. Wei\ss, E. Zakel, and H. Reichl

Thermal Solutions to Pentium® Processors in TCP in Notebooks and Sub-Notebooks

H. Xie, M. Aghazadeh, W. Lui, and K. Haley

Thermal Sensitivity Analysis for the 119 PBGA---A Framework for Rapid Prototyping

S. Mulgaonker and H. M. Berg

SPECIAL SECTION ON ELECTRICAL CONTACTS

Influence of Microstructure on Dielectric Strength of CuCr Contact Materials in a Vacuum

B. Ding, Z. Yang, and X. Wang

Break Arc Duration and Contact Erosion in Automotive Application

N. B. Jemaa, L. Nedelec, and S. Benhenda

The Evaluation of Arc Erosion on Electrical Contacts Using Three-Dimensional Surface Profiles

J. W. McBride, K. J. Cross, and S. M. Abu Sharkh

Availability of Al--Mg Alloys for Use as Electrical Contact Resistors

Y. Kaneko, F. Honda, and K. Nakajima

New Contact Design for the {\it ex situ} Fabrication of Small Size, Low Resistivity Normal Metal Contacts to Epitaxial $c$-Axis YBCO Films

R. Hahn and M. E. Johansson

REGULAR PAPERS

Applicability and Correction of Temperature-Voltage Relation in the Case of Line Contact

Y. Sano and T. Kaneko

Experimental Characterization of Transmission Lines in Thin-Film Multichip Modules

S. Lipa, M. B. Steer, A. C. Cangellaris, and P. D. Franzon

Mechanical Response of PCB Assemblies During Infrared Reflow Soldering

S. Mittal, G. Y. Masada, and T. L. Bergman

Effect of Solid-State Intermetallic Growth on the Fracture Toughness of Cu/63Sn-37Pb Solder Joints

R. E. Pratt, E. I. Stromswold, and D. J. Quesnel

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