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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

June 1996, Volume 19, Issue 2

CONTRIBUTIONS FROM THE INTERNATIONAL SEMINAR ON EVAPORATIVE COOLING OF ELECTRICAL EQUIPMENT

FOREWORD

O. Kabov and A. Bar-Cohen

Designing the Electronica SS BIS Supercomputer

V. A. Melnikov, Y. I. Mitropolski, and G. V. Reznikov

Heat Transfer in Cooling Systems of Microelectronic Equipment with Partially Submerged Condenser

O. A. Kabov

Forced Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel

Y. P. Gan, Q. J. Deng, C. F. Ma, X. Y. Yuan, and D. Y. Cai

REGULAR PAPERS

A Fracture Mechanics Analysis of the Effects of Material Properties and Geometries of Components on Various Types of Package Crack

H. Lee and Y. Y. Earmme

A Cost Analysis Study for Testability Purposes on Silicon Active Substrates

J. Oliver and H. Kerkhoff

Moisture Diffusion and Heat Transfer in Plastic IC Packages

A. A. O. Tay and T. Lin

An Experimental Study of Popcorning in Plastic Encapsulated Microcircuits

R. Gannamani and M. Pecht

Studies of Ni--B as an Electrochemical Metal Migration Barrier

S.-M. Ho, S.-M. Lian, K.-M. Chen, J.-P. Pan, T.-H. Wang, and A. Hung

Effect of the Specimen Size in Predicting the Mechanical Properties of PbSn Solder Alloys

N. R. Bonda and I. C. Noyan

Numerical Analysis of Interfacial Contact Process in Wire Thermocompression Bonding

Y. Takahashi, S. Shibamoto, and K. Inoue

Prediction of Equilibrium Shapes and Pedestal Heights of Solder Joints for Leadless Chip Components

V. Jairazbhoy

Design Optimization of a Laser Bond Tool

L. Economikos and R. Sherif

Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-Field Approach

B. Han and Y. Guo

Forced Convection Air-Cooling of a Commercial Electronic Chassis: An Experimental and Computational Case Study

C. W. Argento, Y. Joshi, and M. D. Osterman

Probe Card with Probe Pins Grown by the Vapor--Liquid--Solid (VLS) Method

S. Asai, K. Kato, N. Nakazaki, and Y. Nakajima

Reliability Evaluation of Process Models

A. Kusiak and A. Zakarian

OPEN FORUM

EDITORIAL

M. Pecht

U.S. Army Reliability Standardization Improvement Policy and Its Impact

M. J. Cushing, J. G. Krolewski, T. J. Stadterman, and B. T. Hum

CORRESPONDENCE

Correction to "Thermal Sensitivity Analysis for the 119 PBGA---A Framework for Rapid Prototyping"

S. Mulgaonker and H. M. Berg