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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

March 1997, Volume 20, Number 01

CONTRIBUTIONS FROM THE SECOND "ADHESIVES '96" INTERNATIONAL CONFERENCE

Foreword

J. E. Morris

[p. 1]

Electrical Conduction Models for Isotropically Conductive Adhesive Joints

L. Li and J. E. Morris

[p. 3]

Polypyrrole as an Interlayer for Bonding Conductive Adhesives to Activated Aluminum Bond Pads

F. Kuechenmeister and E. Meusel

[p. 9]

Study of Isotropically Conductive Bondings Filled with Aggregates of Nano-Sized Ag-Particles

S. Kotthaus, B. H. Günther, R. Haug, and H. Schäfer

[p. 15]

Surface Characteristics, Reliability, and Failure Mechanisms of Tin/Lead, Copper, and Gold Metallizations

J. Liu, K. Gustafsson, Z. Lai, and C. Li

[p. 21]

Adhesion Issues in Epoxy-Based Chip Attach Adhesives

R. A. Pearson, T. B. Lloyd, H. R. Azimi, J.-C. Hsiung M. S. Early, and P. D. Brandenburger

[p. 31]

REGULAR PAPERS

Designing and Building-In Reliability in Advanced Microelectronic Assemblies and Structures

J. W. Evans, J. Y. Evans, and B. K. Yu

[p. 38]

A Fluxless Bonding Technology Using Indium-Silver Multilayer Composites

Y.-C. Chen, W. W. So, and C. C. Lee

[p. 46]

Attenuation in Silver-Filled Conductive Epoxy Interconnects

S. M. Wentworth, B. L. Dillaman, J. R. Chadwick, C. D. Ellis, and R. W. Johnson

[p. 52]

Probabilistic Approach to Evaluate Improvements in the Reliability of a Chip-Substrate (Chip-Card) Assembly

E. Suhir

[p. 60]

Computation of Switching Noise in Printed Circuit Boards

J.-G. Yook, V. Chandramouli, L. P. B. Katehi, K. A. Sakallah, T. R. Arabi, and T. A. Schreyer

[p. 64]

Accurate, Stable, High-Speed Interconnections Using 20- to 30-µm-diameter Microsolder Bumps

H. Tsunetsugu, T. Hayashi, K. Katsura, M. Hosoya, N. Sato, and N. Kukutsu

[p. 76]

OPEN FORUM

Editorial

M. Pecht

[p. 83]

Thermal Derating--A Factor of Safety or Ignorance

M. A. Jackson, P. Lall, and D. Das

[p. 83]

Papers Submitted for Publication

[p. 86]

IEEE Copyright Form

[p. 91]