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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B

FEBRUARY 1995, Volume 18, Issue 1

EDITORIAL

C.-Y. Li

CONTRIBUTIONS FROM THE 3rd INTERNATIONAL EXPOSITION ON MULTICHIP MODULES

FOREWORD

J. A. Nelson and P. Garrou

A Four ASIC MCM-C Design for Manufacturability and the Next Generation Silicon

E. Fulcher and S. Patil

MCM-L Product Development Process for Low-Cost MCM's

P. Thompson

Example of a Mixed-Signal Global Positioning System (GPS) Receiver Using MCM-L Packaging

P. J. Zabinski, B. K. Gilbert, P. J. Zucarelli, D. V. Weninger, and T. W. Keller

Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Modules

T. Shimoto, K. Matsui, and K. Utsumi

MCM Substrate with High Capacitance

R. Kambe, R. Imai, T. Takada, M. Arakawa, and M. Kuroda

MCM-L Technology: A Systems Cost Analysis for a High Volume Automotive Electronics Application

J. L. Evans, L. E. Bosley, C. S. Romanczuk, and R. W. Johnson

Large Area Fine Line Patterning by Scanning Projection Lithography

H. G. M\"{u}ller, Y. Yuan, and R. Sheets

Large Format Fabrication-A Practical Approach to Low Cost MCM-D

G. White, E. Perfecto, D. McHerron, T. DeMercurio, T. Redmond, and M. Norcott

Thin Film Transfer Process for Low Cost MCM-Fabrication

C. Narayan, S. Purushothaman, F. Doany, and A. Deutsch

Integrated Flex: Rigid-Flex Capability in a High Performance MCM

D. N. Light, J. S. Krege, and C. R. Davis

Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array

D. R. Banks, T. E. Burnette, R. D. Gerke, E. Mammo, and S. Mattay

CONTRIBUTIONS FROM THE 44th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

FOREWORD

P. Franzon

Development of a Plastic Encapsulated Multichip Technology for High Volume, Low Cost Commercial Electronics

R. A. Fillion, R. J. Wojnarowski, T. B. Gorcyzca, E. J. Wildi, and H. S. Cole

Concurrent Packaging Architecture Design

L. Cao and J. P. Krusius

Simulation of High Speed Interconnects Using a Convolution-Based Hierarchical Packaging Simulator

M. S. Basel, M. B. Steer, and P. D. Franzon

320 Gb/s High-Speed ATM Switching System Hardware Technologies Based on Copper-Polyimide MCM

N. Yamanaka, K. Endo, K. Genda, H. Fukuda, T. Kishimoto, and S. Sasaki

Algorithms for Coupled Transient Simulation of Circuits and Complicated 3-D Packaging

L. M. Silveira, M. Kamon, and J. White

Electrical Characterization of the Interconnected Mesh Power System (IMPS) MCM Topology

L. W. Schaper, S. Ang, Y. L. Low, and D. Oldham

ADDITIONAL CONTRIBUTIONS FROM THE 44th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

Electrical Performance of Microwave Boards

G. R. Traut

A 3-D Electromagnetic Simulator for High Frequency Applications

Jian-X. Zheng

Cracking Failures in Lead-On-Chip Packages Induced by Chip Backside Contamination

M. Amagai, H. Seno, and K. Ebe

REGULAR PAPERS

Multichip Module Design and Manufacture

Electrical Design of an MCM Package for a Multi-Processor Digital System

A. Sarfaraz, M. Swaminathan, J. Crocker, H. Bhatia, and M. Nealon

Substrate Thickness Optimization for Liquid Immersion Cooled Silicon Multichip Modules

M. Azimi and R. C. Jaeger

To Cut or Not to Cut: A Thermomechanical Stress Analysis of Polyimide Thin-film on Ceramic Structures

M. Pecht, X. Wu, K. Paik, and S. M. Bhandarkar

Open Repair Technologies for MCM-D

T. A. Wassick and L. Economikos

Packaging and Interconnect

High Speed Electrical Characterization and Simulation of a Pin Grid Array Package

T. W. Goodman, H. Fujita, Y. Murakami, and A. T. Murphy

A Low Temperature Co-Fired Ceramic Land Grid Array for High Speed Digital Applications

T. W. Goodman, H. Fujita, Y. Murakami, and A. T. Murphy

Case Study of Ground Plane Inductance and Implications for Simulation

B. Young

A Micromachined Array Probe Card-Fabrication Process

M. Beiley, J. Leung, and S. S. Wong

A Micromachined Array Probe Card-Characterization

M. Beiley, J. Leung, and S. S. Wong

Bonding

Thermocompression Bonding Effects on Bump-Pad Adhesion

Y.-G. G. Kim, J. K. Pavuluri, J. R. White, I. J. Busch-Vishniac, and G. Y. Masada

The Effect of Wirebond Geometry and Die Setting on Wire Sweep

A. A. O. Tay, K. S. Yeo, and J. H. Wu

Estimation of Aluminum and Gold Bond Wire Fusing Current and Fusing Time

A. Mertol

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