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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

May 1995, Volume 18, Issue 2

CONTRIBUTIONS FROM THE 44th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

FOREWORD

R. A. Boudreau

Performance and Reliability of Optical Fiber Connectors in the Outside Plant Environment

A. K. Agarwal and L. D. Hutcheson

A Small Coaxial Laser Module for the Gb/s Transmission-Speed Range

H. van Tongeren, J. W. Kokkelink, and H. Tjassens

Fabrication of Low Loss Polyimide Optical Waveguides Using Thin-Film Multichip Module Process Technology

A. J. Beuhler, D. A. Wargowski, K. D. Singer, and T. Kowalczyk

Low-Cost Molded Packaging for Optical Data Links

S. D. Robinson, M. S. Acarlar, Y. C. Chen, L. T. Manzione, G. J. Shevchuk, and D. Stefanik

Low-Loss Intersecting Grooved Waveguides with Low $\Delta$ for a Self-Holding Optical Matrix Switch

Y. Hanaoka, F. Shimokawa, and Y. Nishida

Laser-Detector-Hologram Unit for Thin Optical Pick-Up Head of a CD Player

A. Yoshikawa, H. Nakanishi, K. Itoh, T. Yamazaki, T. Komino, and T. Musha

ADDITIONAL CONTRIBUTIONS FROM THE 44th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

Flip Chip Packaging

C-4/CBGA Comparison with Other MLC Single Chip Package Alternatives

K. J. Puttlitz and W. F. Shutler

Reliable Au--Sn Flip-Chip Bonding on Flexible Prints

A. F. J. Baggerman and M. J. Batenburg

Multichip Modules

Mechanical and Electrical Evaluation of a Bumped-Substrate Die-Level Burn-in Carrier

P. Thompson, M. Begay, S. E. Lindsey, D. R. Vanoverloop, B. Vasquez, S. Walker, and B. Williams

MCM-LD: Large Area Processing Using Photosensitive-BCB

A. J. G. Strandjord, P. E. Garrou, R. H. Heistand, and T. G. Tessier

Manufacturability of Capacitively Coupled Multichip Modules

D. B. Salzman and T. F. Knight, Jr.

CONTRIBUTIONS FROM THE FIRST INTERNATIONAL CONFERENCE ON ADHESIVE JOINING TECHNOLOGY IN ELECTRONICS MANUFACTURING

FOREWORD

J. E. Morris

Conductive Adhesives for SMT and Potential Applications

H. L. Hvims

Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?

J. C. Jagt, P. J. M. Beris, and G. F. C. M. Lijten

Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives

M. A. Gaynes, R. H. Lewis, R. F. Saraf, and J. M. Roldan

Reliability Assessment of Isotropically Conductive Adhesive Joints in Surface Mount Applications

R. S. Rorgren and J. Liu

Development of Conductive Adhesive Joining for Surface-Mounting Electronics Manufacturing

J. Liu, L. Ljungkrona, and Z. Lai

Reliability Issues of Replacing Solder with Conductive Adhesives in Power Modules

O. Rusanen and J. Lenkkeri

Modeling Joining Materials for Microelectronics Packaging

J. K. Kivilahti

CONTRIBUTION FROM THE THIRD INTERNATIONAL EXPOSITION ON MULTICHIP MODULES

Electroless Nickel/Copper Plating as a New Bump Metallization

R. Aschenbrenner, A. Ostmann, U. Beutler, J. Simon, and H. Reichl

REGULAR PAPERS

Issues in Packaging

Performance, Wireability, and Cooling Tradeoffs for Planar and 3-D Packaging Architectures

G. George and J. P. Krusius

Thick-Film Resistor/Dielectric Interactions in a Low Temperature Co-fired Ceramic Package

R. C. Sutterlin, G. O. Dayton, and J. V. Biggers

Corrosion in Plastic Packages—Sensitive Initial Delamination Recognition

O. Selig, P. Alpern, and R. Tilgner

Latent Open Defect Detection Using Phase-Sensitive Nonlinearity Detection Technique

A. Halperin, T. H. DiStefano, and S. Chiang

Inner Lead Gang-Bonded Devices with Stacked Ni--Au Bumps

A. F. J. Baggerman, and J. A. H. van Gerven

Electrical Performance Modeling

An Extended Time-Domain Network Analysis Measurement Technique

L.-T. Hwang, G. A. Rinne, and I. Turlik

Analysis of a Multilayered-Metal Thin-Film Transmission Line

L.-T. Hwang, G. A. Rinne, and I. Turlik

Power Cycling and Stress Variation in a Multichip Module

B. Sur and I. Turlik

ANNOUNCEMENTS

List of Reviewers

Call for Papers: Electrical Performance of Electronic Packaging

IEEE Membership Application

Special Sections Planned for 1995--1996