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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

February 1996, Volume 19, Issue 1

EDITORIAL

C.-Y. Li

CONTRIBUTIONS FROM THE 45th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

FOREWORD

J. M. Segelken

SPICE-Models for High-Pincount Board Connectors

H. Katzier, R. Reischl, and P. Pagnin

High Frequency Measurement of Multilayer Ceramic Capacitors

Y. Sakabe, M. Hayashi, T. Ozaki, and J. P. Canner

A Simultaneous Switching Noise Design Algorithm for Leadframe Packages with or without Ground Plane

C. Huang, Y. Yang, and J. L. Prince

Field-Based Analysis of a High Pincount Board Connector

H. Wolter, H. Katzier, O. Pod\v{e}brad, and T. Weiland

A Novel Method of Measuring Microelectronic Interconnect Transmission Line Parameters and Discontinuity Equivalent Electrical Parameters Using Multiple Reflections

C. E. Abernethy, A. C. Cangellaris, and J. L. Prince

SPECIAL SECTION ON MICROWAVE PACKAGING

FOREWORD

A. Elshabini-Riad

The Use of BCB in High Frequency MCM Interconnects

V. B. Krishnamurthy, H. S. Cole, and T. Sitnik-Nieters

Time-Domain Characterization and Circuit Modeling of a Multilayer Ceramic Package

J.-M. Jong, B. Janko, and V. K. Tripathi

A New Bonding Technique for Microwave Devices

G. R. Dohle, J. J. Callahan, K. P. Martin, and T. J. Drabik

Efficient Transient Simulation of Lossy Packaging Interconnects Using Moment-Matching Techniques

M. Celik and A. C. Cangellaris

A Rigorous Method to Evaluate the Electrical Performance of MCM Interconnections in Frequency and Time Domains

R. Salik, J.-W. Tao, G. Angénieux, and B. Fléchet

CONTRIBUTIONS FROM THE 7th NATIONAL MEETING OF THE LASERS AND ELECTRO-OPTICS SOCIETY (LEOS)

FOREWORD

B. A. Boudreau

A Passive Micromachined Device for Alignment of Arrays of Single-Mode Fibers for Hermetic Photonic Packaging—The CLASP Concept

S. H. Kravitz, J. C. Word, T. M. Bauer, P. K. Seigal, and M. G. Armendariz

Silicon Waferboard-Based Single-Mode Optical Fiber Interconnects

P. O. Haugsjaa, G. A. Duchene, J. F. Mehr, A. J. Negri, and M. J. Tabasky

Thin-Film Multimaterial Optoelectronic Integrated Circuits

N. M. Jokerst, M. A. Brooke, O. Vendier, S. Wilkinson, S. Fike, M. Lee, E. Twyford, J. Cross, B. Buchanan, and S. Wills

Optoelectronic Packaging of Two-Dimensional Surface Active Devices

N. R. Basavanhally, M. F. Brady, and D. B. Buccholz

Multichannel Optical Modules Compatible with the Fiber-In-Board Technology

G. De pestel, A. Ambrosy, Q. Tan, M. Vrana, F. Migom, H. Richter, J. Vandewege, and P. Vetter

New Optical and Electrical Hybrid Packaging Techniques Using Optical Waveguides for Optoelectronic Multichip Modules

S. Koike, F. Shimokawa, T. Matsuura, and H. Takahara

REGULAR PAPERS

Solder Process Development and Analysis

Application of a CFD Tool in Designing a Fountain Plating Cell for Uniform Bump Plating of Semiconductor Wafers

T.-Y. T. Lee, W. H. Lytle, and B. Hileman

Reliability and Au-Concentration in OLB Solder Fillets of TAB-Devices Having a 75 $\mu$m Pitch

E. Zakel, J. Villain, and H. Reichl

An Experimental Approach to Pore-Free Reflow Soldering

D. J. Xie, Y. C. Chan, and J. K. L. Lai

Effect of Cooling Rate on Interfacial Fatigue-Crack Growth in Sn--Pb Solder Joints

D. Yao and J. K. Shang

Single-Chip Packaging

A Hi-Density C4/CBGA Interconnect Technology for a CMOS Microprocessor

G. B. Kromann, R. D. Gerke, and W. W.-X. Huang

Leadless 432-Pin Package and Solderless Socket Used in a System Operating with a 622 MHz Digital Clock

J. S. Loos

Development of Ultra-Compact Plastic-Packaged High-Isolation GaAs SPDT Switch

H. Uda, T. Hirai, H. Tominaga, K. Nogawa, T. Sawai, T. Higashino, and Y. Harada

Multichip Modules

Design and Evaluation of an Epoxy Three-Dimensional Multichip Module

J. M. Stern, S. P. Larcombe, P. A. Ivey, L. Seed, A. J. Shelley, and N. J. Goodenough

Structured Test Methodologies and Test Economics for Multichip Modules

K. T. Kornegay and K. Roy

Theory of Pressure Sintering of Glass Ceramic Multichip Carriers

H.-M. Tong, D. Goland, and D. Chance

Case Study: The Design of a Mixed-Signal Global Positioning System Receiver Using Multichip Module Packaging

P. J. Zabinski, M. E. Vickberg, B. K. Gilbert, P. J. Zucarelli, D. V. Weninger, T. W. Keller, and D. M. Yee

Interconnect Modeling

Measurement of Package Inductance and Capacitance Matrices

B. Young and A. K. Sparkman

Guidelines for High-Performance Electronic Package Interconnections---A Simple Approach

Y. Yang and J. R. Brews

Joint Design Methodology Based on the Electromagnetic Shielding Effectiveness Capabilities

B. D. Mottahed and S. Manoochehri

Thermal Analysis

Temperature and Stress Time History Responses in Electronic Packaging

J. H. Lau

Transient Thermal Response Due to Periodic Heating on a Convectively Cooled Substrate

T. S. Fisher, C. T. Avedisian, and J. P. Krusius

CORRESPONDENCE

Correction to "A Silicon-on-Silicon Field Programmable Multichip Module (FPMCM)---Integrating FPGA and MCM Technologies"

J. Darnauer, T. Isshiki, P. Garay, J. Ramirez, V. Maheshwari, and W. W.-M. Dai

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