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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

February 1997, Volume 20, Issue 1

Editorial

P. Krusius

[p. 1]

REGULAR PAPERS

Multichip Modules

A Novel Test Technique for MCM Substrates

B. Kim, M. Swaminathan, A. Chatterjee, and D. Schimmel

[p. 2]

Integration of Vapor Deposited Polyimide into a Multichip Module Packaging Process

V. Liberman, V. Malba, and A. F. Bernhardt

[p. 13]

Implementation of a Gallium Arsenide Multichip Digital Circuit Operating at 500-1000 MHz Clock Rates Using a Si/Cu/SiCO₂ MCM-D Technology

B. K. Gilbert, B. A. Randall, B. L. Donham, D. J. Schwab, D. C. Benson, D. B. Tuckerman, and W. P. Goodwin

[p. 17]

Multichip MMIC Package for X and K_a Bands

D. R. Decker, H. M. Olson, R. Tatikola, R. Gutierrez, and N. R. Mysoor

[p. 27]

Electrical Modeling and Performance

FDTD Analysis of the Electrical Performance for Interconnection Lines in Multichip Module (MCM) with Perforated Reference Planes

J. Zhao and Z. Li

[p. 34]

Modeling and Experimental Verification of the Interconnected Mesh Power System (IMPS) MCM Topology

Y. L. Low, L. W. Schaper, and S. S. Ang

[p. 42]

Return Path Inductance in Measurements of Package Inductance Matrixes

B. Young

[p. 50]

Package Clock Distribution Design Optimization for High-Speed and Low-Power VLSI's

Q. Zhu and S. Tam

[p. 56]

Electrical Characteristics of High-Pe [need rest of title ...]

P. Krusius

[p. 1]

REGULAR PAPERS

Multichip Modules

A Novel Test Technique for MCM Substrates

B. Kim, M. Swaminathan, A. Chatterjee, and D. Schimmel

[p. 2]

Integration of Vapor Deposited Polyimide into a Multichip Module Packaging Process

V. Liberman, V. Malba, and A. F. Bernhardt

[p. 13]

Implementation of a Gallium Arsenide Multichip Digital Circuit Operating at 500-1000 MHz Clock R K. L. Lai
[p. 87]

Thermal Limits of Flip Chip Package--Experimentally Validated, CFD Supported Case Studies

T.-Y. T. Lee and M. Mahalingam

[p. 94]

Improved Heat Sinking for Laser-Diode Arrays Using Microchannels in CVD Diamond

K. E. Goodson, K. Kurabayashi, and R. F. W. Pease

[p. 104]

Call for Papers

[p. 112]

IEEE Copyright Form

[p. 115]