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Resources:
Who we are
Joining CPMT
Chapter Chair
Chapter Officers
The Olympic Torch
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
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(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
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Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
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Technical/Skills/Management Short Courses:
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Meetings for 2010/2011:
"Embedded Passives: Packaging Paradigm of the Future?"
Jason Ferguson, Crane Naval Surface Warfare Center
-- dinner Wednesday, September 9
"Design of High Density & 3D Packaging: Tools and Knowledge"
Thomas Tarter, Package Science Services LLC
-- lunch Thursday, September 23
"Good Things Come in Small Packages"
Sandra Winkler, New Venture Research
-- lunch Thursday, October 28
Downloadable Slides from Recent Talks (most recent last)
"Winner Take All: How Competitiveness Shapes the Fate of Nations", Richard J. Elkus, Jr. (100 kB PDF)
"Integrated RF-CMOS MEMS Solutions for Mobile Terminals", Jeffrey L. Hilbert, President, WiSpry, Inc. (750 kB PDF)
"3D IC Integration: The Next Generation of Electronics", "Bill" Bottoms, Chairman, Third Millennium Test Solutions (1.6 MB PDF)
"Large-Scale Print-Manufacturing of Complex 3D Structures", Arthur Chait, EoPlex Technologies, Inc. (2 MB PDF)
"Thin is In: Thinning of IC Chips", Annette Teng, Ph.D., CORWIL Technology Corp. (800 kB PDF)
"High-Reliability Through Silicon Via (TSV) Solutions for Image Sensor Packaging", Belgacem Haba, Ph.D., Tessera (1.2 MB PDF)
"3D Accelerometer MEMS in a Context of Gaming and Healthcare", Ed Brachocki, Kionix, Inc. (2.2 MB PDF)
Other Slides from Past Talks: See the CPMT Members-Only website.
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Professional Skills Development and Management Classes:
Contact
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other Summer classes.
Mastering Difficult Conversations
[more]
- July 13 at Trimble Navigation, Sunnyvale
Managing Managers
[more]
- July 13-14 at TIBCO Software, Palo Alto
Virtual Teams: Working Together Apart
[more]
- July 27 at TIBCO Software, Palo Alto
Management Essentials
[more]
- August 5-6 at TIBCO Software, Palo Alto
Presentation Skills for Engineers
[more]
- August 12 at TIBCO Software, Palo Alto
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See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to
Paul Wesling.]
Ideas for Future Meetings?
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Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal:
Design Issues:
Oscar MahinFallah: EMC
Components Issues:
(vacant): embedded pasives design & fabrication
Packaging Issues:
John Jackson: Flip Chip and CSP
Allen Earman: Lakeland Photonics
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
Ephraim Suhir: nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
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Reliability and Qualification Testing:
Ephraim Suhir: product development, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Annette Teng:
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free
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