(<=== click on the map, for a better view) We welcome you to Silicon Valley, the home of the Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology Society! We're quite active, with a regular series of Monthly Evening Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.

Upcoming IEEE/CPMT Society Events In the Santa Clara Valley   (Print out and post/circulate)

Monthly Technical Meetings: (everyone is welcome!)

Technical/Skills/Management Short Courses:

Meetings for 2009/2010: "Large-Scale Print Manufacturing of Complex, Miniature 3D Structures" Arthur Chait, President and CEO, EoPlex Technologies, Inc. -- dinner Wednesday, February 10 "3D IC Integration: The Next Generation of Electronics" Dr. W. R. "Bill" Bottoms, Chairman, Third Millennium Test Solutions -- dinner Wednesday, March 10 "Integrated RF-CMOS MEMS Solutions for Mobile Terminals" Jeffrey L. Hilbert, President, WiSpry, Inc. (Irvine, CA) -- lunch Thursday, March 25 "Assembly and Applications of Microscopically Small Electronic Components" Babak A. Parviz, Micro-Scale Life Sciences Center, University of Washington -- dinner Wednesday, April 14 "" Downloadable Slides from Recent Talks (most recent last) "Thin is In: Thinning of IC Chips", Annette Teng, Ph.D., CORWIL Technology Corp. (800 kB PDF) "High-Reliability Through Silicon Via (TSV) Solutions for Image Sensor Packaging", Belgacem Haba, Ph.D., Tessera (1.2 MB PDF) "3D Accelerometer MEMS in a Context of Gaming and Healthcare", Ed Brachocki, Kionix, Inc. (2.2 MB PDF) "Nanopackaging: Nanotechnologies in Microelectronics Packaging", James E. Morris, Portland State University (2 MB PDF) "Molecular Modification of PCB Substrates: Demonstration of HAST Survivability of Fine-Line Patterned Structures", Werner Kuhr, Ph.D., ZettaCore, Inc. (400 kB PDF) "License to Speed: Extreme Bandwidth Packaging", Sean Cahill, BridgeWave Communications (600 kB PDF) "Through-Silicon Vias (TSVs): Design and Reliability", Sergey Savastiouk, ALLVIA, Inc. (200 kB PDF) "Is Cu Wirebonding for Real?", Amy Low, Heraeus Inc. (550 kB PDF) "Wafer Level Packaging – Next Turn in the Road", Dr. Thomas Di Stefano, Centipede Systems (550 kB PDF) "Is Cu Wirebonding for Real?", Amy Low, Heraeus Inc. (550 kB PDF) Other Slides from Past Talks: See the CPMT Members-Only website. Local IEEE Conferences during 2009-10: Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2010) at the Hyatt Hotel, Santa Clara -- Feb. 21-25, 2010

Upcoming Technical Courses: "Design of Air and Water Cooled Heat Exchangers for Electronics Cooling: A Critical Review of Data and Analysis Methods for Heat Sinks and Cold Plates" Alfonso (Al) Ortega, Ph.D., Villanova University -- Hyatt Regency Santa Clara Convention Center, February 21. "Cooling Challenges in 3D Packaging" Dereje Agonafer, Ph.D., University of Texas at Arlington -- Hyatt Regency Santa Clara Convention Center, February 21. "Estimating Experimental Uncertainty" Robert J. Moffat, Ph.D., Stanford University (Emeritus) -- Hyatt Regency Santa Clara Convention Center, February 22. "Energy Efficient Thermal Management of Data Centers" Yogendra Joshi, Ph.D., Georgia Institute of Technology -- Hyatt Regency Santa Clara Convention Center, February 22. Professional Skills Development and Management Classes: Contact Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list for other Winter classes. Project Management: Team-Based Accountability [more] - February 16-17 at TIBCO Software, Palo Alto Management Essentials [more] - March 16-17 at TIBCO Software, Palo Alto Presentation Skills for Engineers [more] - March 17 at Integrated Device Technology, San Jose Strategic Thinking for Managers [more] - April 21 at TIBCO Software, Palo Alto Collaborative Negotiating [more] - May 4 at TIBCO Software, Palo Alto Managing Managers [more] - May 18-19 at TIBCO Software, Palo Alto

See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to Paul Wesling.]