An IEEE Professional Development Course in San Francisco

"Integrated Passives: Technology and Commercialization"
with Dr. Richard Ulrich, University of Arkansas

DATE & TIME:
Tuesday, August 12, 2003
Registration: 8:00 - 8:30 AM
Class: 8:30 AM - noon 		COST:
  • IEEE Members: $50; Non-Members: $80; Students: $25
    (Higher fee, after Aug. 1)
  • Includes class handouts and refreshments
  • We invite you to attend the free "Trends and Opportunities for Integrated Passives" Panel Discussion, 1:30 - 3:00 PM
  • $50 discount when co-registering for the "SoC Test" half-day course Tuesday afternoon.
    • LOCATION:
    Moscone Convention Center, San Francisco -- part of the IEEE WESCON North America Exhibition.

    OUTLINE:
    This course is a comprehensive review of the technology, applications, and possible future directions in integrated passive components for organic boards. The organization of the course centers on the benefits and problems with their implementation in order to help potential users make decisions about their applicability in a given situation. This course will be of benefit to engineers and scientists involved in electronics packaging, circuit board manufacture, electrical design and passive component technologies. Attendees of the Course can purchase the book "Integrated Passive Component Technology," published by IEEE/Wiley, at the Course at a substantial discount from list price.

    WHO SHOULD ATTEND:
    This course is appropriate for design, process, manufacturing and quality engineers, production management, and purchasing staff for high density electronics, including RF/wireless, controllers, and consumer and aerospace products.

    OUTLINE:

    ABOUT THE INSTRUCTOR:
    Dr. Richard Ulrich graduated with his PhD in chemical engineering in 1983 from the University of Texas at Austin. He then worked at Texas Instruments' Advanced Packaging Laboratory in Dallas before joining the faculty of the Department of Chemical Engineering at the University of Arkansas in 1987. His research has centered on the materials aspects of HDI packaging, particularly integrated passives. He is the lead author (with Len Schaper) of "Integrated Passive Component Technology," to be published by IEEE Press in June 2003. This is the first book dedicated to this topic. He is a NEMI committee member, a visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division. He is developing an on-line course in integrated passives, funded by a grant from IEEE/NSF, and is active in consulting and short courses.

    TO REGISTER:

  • You may download, print and mail/FAX the registration form for the "Integrated Passives" Course and other Professional Development Courses (300kB PDF).

  • You may use the internet to register on-line.

    Last updated on || Send comments to Paul Wesling.