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OVERVIEW:

As higher-function, higher-dissipation, and mixed-mode ICs reach the marketplace, the mix of packaging methods reflects the needs of the device and of its product. Much of packaging is based on high-density wire bonding, but many newer applications are using flip-chip and CSP techniques.

In this talk, we'll examine the technical requirements of substrates and the use of interposers as the "impedance translators" from chip-level wiring densities to those of the substrate. The choices affect signal integrity, thermal conductance, reliability, and cost.

Speaker Biography

As Vice President of Substrate Technology at Amkor, Ron Huemoeller is responsible for substrate innovation, world-wide supplier development, and strategic planning/business development of new products and technologies. Prior to Amkor, Ron held senior level positions at both Cray Computer Corporation in Colorado and Control Data-Government Systems in Minnesota in the capacity of manufacturing/development of advanced motherboard and supercomputer module systems. Ron has a proven track-record in product development and product launch from the R&D stage through full scale production, with over 18 years of experience in the electronics industry and extensive background and knowledge in advanced packaging. He holds over 25 U.S. Patents in both motherboard and packaged substrates and has authored numerous papers.

Education: B.S. in Chemistry from Minnesota, where he graduated with highest honors and was elected to the National Honor Society. He studied his Masters in Business Education at Arizona State University.